Dielectric etch carves patterns in insulating materials to create barriers between the electrically conductive parts of a semiconductor device. For advanced devices, these structures can be extremely tall and thin and involve complex, sensitive materials. 

Slight deviations from the target feature profile – even at the atomic level – can negatively affect electrical properties of the device. To precisely create these challenging structures, Lam’s Flex product family offers differentiated technologies and application-focused capabilities for critical dielectric etch applications.